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N2M
Managed NAND
X
eMMC Version
4 = Version 4.41
XXX
Density
00F = 4GB00G = 8GB00H = 16GB00J = 32GB
X
Lytho
D = 25nm
X
Temperature Range
B = Extended (-40°C to 85°C)
X
Voltage
3 = 3.0V
X
Configuration
1 = 1 die2 = 2 die4 = 4 die
XXX
Package
1A3 = 100-ball LBGA (14x18x1.4mm - 1mm)
X
Firmware ID
C = Combo
X
Media
E = TrayF = Tape and Reel
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.